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| ZY552A QFP52适配座 |
| 适配座型号: ZY552A 适用封装名: QFP52 适用芯片 20脚及20脚以下的SOIC(Wide)封装的芯片 (SOIC脚芯片封装参数如下)芯片封装略图 |
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| ENPLAS QFP测试座 Open-Top Sockets |
| QFP(Plastic Quad Flat Pockage)是方型扁平式封装技术,该技术实现的芯片引脚之间距离很小,管脚很细,一般大规模或超大规模集成电路采用这种封装形式,其引脚数一般都在100以上。该技术封装时操作方便,可靠性高;而且其封装外形尺寸较小,寄生参数减小,适合高频应用;QFP封装主要适合用SMT表面安装技术在PCB上安装布线。QFP老化测试座 QFP SOCKET 封装:QFP/TQFP/PQFP/LQFP/CQFP IC测试座/老化测试插座1. Open-Top Sockets One-Point Contact (Unit: mm)Part NumberPin CountPitchActuationTip-TipBody WidthMFR.ForceOTQ-44-0.8-01440.81.8kg13.9X13.910X10ENPLASOTQ-44-0.8-02440.81.8kg13.2X13.210X10ENPLASOTQ-44-0.8-03440.81.8kg12.4X12.410X10ENPLASOTQ-52-0.65-01520.652.0kg13.9X13. |
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| QFP老化测试座 |
| QFP老化测试座 QFP SOCKET QFP(Plastic Quad Flat Pockage)是方型扁平式封装技术,该技术实现的芯片引脚之间距离很小,管脚很细,一般大规模或超大规模集成电路采用这种封装形式,其引脚数一般都在100以上。该技术封装时操作方便,可靠性高;而且其封装外形尺寸较小,寄生参数减小,适合高频应用;QFP封装主要适合用SMT表面安装技术在PCB上安装布线。 封装:QFP/TQFP/PQFP/LQFP/CQFP IC测试座/贴片测试插座Pitch:0.4mm,0.5mm,0.635mm,0.65mm,0.8mm,1.0mmQFP贴片测试座型号列表Part NumberPin CountPitch(mm)IC-Body SizeMFR.IC149-044-*52-S5440.810 x 10YAMAICHIIC149-044-*49-S5440.814 x 14YAMAICHIIC149-048-*56-S5480.810 x 10YAMAICHIIC149-064-*69-*5640.510 x 10YAMAICHIIC149-064-*75-*5640.510 |
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| QFP老化测试座 |
| QFP老化测试座 QFP SOCKET QFP(Plastic Quad Flat Pockage)是方型扁平式封装技术,该技术实现的芯片引脚之间距离很小,管脚很细,一般大规模或超大规模集成电路采用这种封装形式,其引脚数一般都在100以上。该技术封装时操作方便,可靠性高;而且其封装外形尺寸较小,寄生参数减小,适合高频应用;QFP封装主要适合用SMT表面安装技术在PCB上安装布线。 封装:QFP/TQFP/PQFP/LQFP/CQFP IC测试座/老化测试插座Pitch:0.4mm,0.5mm,0.635mm,0.65mm,0.8mm,1.0mmQFP-IC200 No. ofBodyMatching Package Dimensions MFR.Part NumberLeadsWidthPitchABCE(Max)F(Max)NotesIC200-1284-00112828 x 280.8mm32322830.630.6Clamshell IC51-1284-976-1YAMAICHIIC200-2084-01020828 x 280.5mm30.630.62829.82 |
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| QFP老化测试座 |
| QFP老化测试座 QFP SOCKET QFP(Plastic Quad Flat Pockage)是方型扁平式封装技术,该技术实现的芯片引脚之间距离很小,管脚很细,一般大规模或超大规模集成电路采用这种封装形式,其引脚数一般都在100以上。该技术封装时操作方便,可靠性高;而且其封装外形尺寸较小,寄生参数减小,适合高频应用;QFP封装主要适合用SMT表面安装技术在PCB上安装布线。 封装:QFP/TQFP/PQFP/LQFP/CQFP IC测试座/老化测试插座Pitch:0.4mm,0.5mm,0.635mm,0.65mm,0.8mm,1.0mmQFP封装老化测试座680 Series QFP SocketOpen top, Zero Insertion Force design for automatic loadingCompact outline for maximum board densityHighly reliable Dual Beam contact design, "H" versionLid actuation force peaks during stroke |
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| YAMAICHI QFP |
| IC120 Series (Open Top) Plastic Lead Chip Carrier (PLCC) Specifications Part Number (Details) Insulation Resistance: 1,000MΩ min. at 500V DCDielectric Withstanding Voltage: 700V AC for 1 minuteContact Resistance: 30mΩ max. at 10mA/20mV max. Current Rating: 1A max. Operating Temperature Range:–40°C to +170°C Mating Cycles: 10,000 insertions min. 10,000 insertions min. Note:Mounting Flange is not available for 18 pins,22 pins and IC120-0684-304 Materials and Finish Housing:Upper body – Polyphenyl |
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